News

August 19, 2010 Peel Packaging for IC’s Provide Multiple Benefits

Courtesy of www.electropages.com An innovative and ‘unique’ peel packaging solution for integrated circuits (ICs) designed to benefit its customers worldwide has been announced by Farnell. Peel packaging offers complete protection to each individual component in transit, storage and handling by placing them within a protective, recyclable and biodegradable plastic cell which is then sealed with […]